Hermetically sealed vias
AssigneeSamtec, Inc.
InventorMark Crain
Life of this patent
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Abstract
Electrical components, and associated methods for manufacturing, are described herein. In one aspect, an electrical component can include a substrate defining a first external surface and a second external surface opposite the first surface, and an internal surface that extends from the first external surface toward the second external surface; an electrically conductive layer that extends along the internal surface of the substrate between the first and second surfaces; and an electrically conductive end cap that is bonded to the electrically conductive layer and extends at least to the first surface.
Claims20
A method for manufacturing an electrical component comprising:
- disposing a first electrically conductive layer along an internal surface of a substrate between a first external surface and a second external surface of the substrate, wherein the internal surface extends from the first external surface toward the second external surface;
- applying a wetting mitigation agent along a least a portion of the first electrically conductive layer;
- disposing a second electrically conductive material to the first electrically conductive material, wherein the second electrically conductive material bonds to another portion of the electrically conductive material that is free of the wetting mitigation agent, thereby forming an end cap.
Dependencies are inferred from the claim text.