Material supplying device, three dimensional molding device, and injection molding device
AssigneeSeiko Epson Corporation
InventorMasaaki OGIHARA
Life of this patent
Estimating the term…
Loading patent…
AssigneeSeiko Epson Corporation
InventorMasaaki OGIHARA
Estimating the term…
A material supplying device includes a plasticizing section configured to plasticize a material to generate a plasticization material; a nozzle configured to supply the plasticization material to the outside; a supply control mechanism that is provided in a flow path communicating with the plasticizing section and the nozzle, and that is configured to adjust a supply amount of the plasticization material from the nozzle to the outside; a pressure sensor configured to measure the pressure of the plasticization material in the flow path; and a control section configured to control an operation of the supply control mechanism, wherein the control section is configured to calculate a backlash value indicating backlash of the supply control mechanism based on detection data including a detection value output from the pressure sensor, and the detection data is data including in time series the detection values output from the pressure sensor.
A material supplying device comprising:
Dependencies are inferred from the claim text.