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US 2025/0360696 A1Published application
Multilayer film and packaging material using same
AssigneeKuraray Co., Ltd.
InventorsSatoshi ISHIUCHI, Kentaro YOSHIDA
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Abstract
The present disclosure provides a multilayer film with a layer (A) containing an EVOH; a layer (B) containing an adhesive resin (b); a layer (C) containing a polyethylene-based resin (c); and a layer (D) containing an ethylene-α-olefin copolymer resin (d).
Claims22
A multilayer film, comprising:
- a barrier layer (A) containing an ethylene-vinyl alcohol copolymer (a) as a main component, the copolymer (a) having an ethylene unit content from 20 to 50 mol % and a degree of saponification of 90 mol % or more;
- an adhesive layer (B) containing an adhesive resin (b) as a main component;
- a thermoplastic resin layer (C) containing a polyethylene-based resin (c) as a main component, the resin (c) having a density from 0.941 to 0.980 g/cm3;
- and a heat seal layer (D) containing an ethylene-α-olefin copolymer resin (d) as a main component, the resin (d) having a density from 0.880 to 0.920 g/cm3, wherein
- the multilayer film has the barrier layer (A) between at least a pair of the thermoplastic resin layer (C) and the heat seal layer (D)
- and has no layer containing a resin with a melting point of 200° C. or more as a main component and no metal layer with a thickness of 1 μm or more, and
- when a temperature is risen from −50° C. to 220° C. at 10° C./min (first temperature rise) and then lowered to −50° C. at 10° C./min and further risen to 220° C. at 10° C./min (second temperature rise) using a differential scanning calorimeter (DSC), a ratio (H1/H2) of a total heat of fusion (H1) from 0° C. to 150° C. during the first temperature rise to a total heat of fusion (H2) from 0° C. to 150° C. during the second temperature rise is from 0.75 to 1.01.
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Dependencies are inferred from the claim text.