Chemical mechanical polishing method using foamed slurry and apparatus for foamed slurry generation
AssigneeApplied Materials, Inc.
InventorsEkaterina MIKHAYLICHENKO, Brian J. BROWN
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Materials, Inc.
InventorsEkaterina MIKHAYLICHENKO, Brian J. BROWN
Estimating the term…
Embodiments of the present disclosure generally relate to dispensing slurry as a foam in chemical mechanical polishing systems. A polishing apparatus includes a platen, a polishing pad having a polishing surface and disposed on the platen, a carrier head configured to press a substrate onto the polishing surface, a spray bar assembly configured to dispense a polishing foam onto the polishing surface, and a controller coupled to the polishing apparatus and configured to cause the polishing apparatus to: place a substrate on the polishing surface using the carrier head, create a polishing foam using a polishing liquid, a surfactant, and a gas using the spray bar assembly, use the spray bar assembly to dispense the polishing foam onto the polishing pad, and rotate the polishing pad using the platen to polish the substrate.
A polishing apparatus, comprising:
A spray bar assembly, comprising:
A method of polishing a substrate, comprising:
Dependencies are inferred from the claim text.