Integrated circuit, system and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTe-Hsin CHIU, Wei-Cheng LIN, Wei-An LAI, Jiann-Tyng TZENG
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTe-Hsin CHIU, Wei-Cheng LIN, Wei-An LAI, Jiann-Tyng TZENG
Estimating the term…
An integrated circuit includes a first power rail on a back-side of a substrate, and extending in a first direction, a first and second flip-flop, and a first conductor on a first metal layer and extending in a second direction. The first flip-flop includes a first region that includes a first inverter, a second inverter having a first output pin, and a first input pin. The second flip-flop includes a second region that abuts the first region at a first boundary, and includes a third inverter, a fourth inverter having a second output pin, and a second input pin. The first conductor overlaps the first boundary, and electrically couples the first output pin and the second output pin together. The first and second flip-flop are on a front-side of the substrate. The first input pin is offset from the first boundary in the second direction.
An integrated circuit, comprising:
An integrated circuit, comprising:
An integrated circuit, comprising:
Dependencies are inferred from the claim text.