Temperature control plate and method for producing a temperature control plate

A temperature control plate for the temperature control of electronic components or batteries, the temperature control plate comprising:

• a plate body which has a first plate element and a second plate element;
• at least one connecting piece for a temperature control fluid, wherein the at least one connecting piece joins together the first plate element and the second plate element,
• the at least one connecting piece has an outer flange and a plug-in section, wherein the outer flange abuts an outside of the first plate element, and the plug-in section is positioned in a mounting opening of the first plate element which comprises an end section of the plug-in section, wherein the mounting opening is arranged in a formation in the first plate element,
• wherein a circumferential edge of the mounting opening is displaced in relation to a plate plane of the first plate element and the end section comprises an inner flange,
• wherein an annular groove is between the outer flange and the inner flange and the circumferential edge is accommodated in the annular groove.

A method of producing a temperature control plate having a connecting piece, the comprising:

• forming a formation in a first plate element and producing a mounting opening in the first plate element, wherein, during the forming of the formation, a bottom of the formation or a circumferential edge of the mounting opening is displaced in relation to a plate plane of the first plate element;
• inserting a plug-in section of a connecting piece into the mounting opening until an outer flange of the connecting piece abuts the first plate element;
• forming an end section of the plug-in section into an inner flange, wherein an annular groove is formed between the outer flange and the inner flange and the circumferential edge of the mounting opening is fixed in the annular groove between the outer flange and the inner flange;
• forming a plate stack from the first plate element and the second plate element, wherein a solder material is appliable between the first plate element and the second plate element;
• inserting the plate stack into a heat forming soldering tool, which has a lower tool and an upper tool;
• closing the heat forming soldering tool and clamping the plate stack between the lower tool and the upper tool;
• heating the plate stack;
• subjecting a space between the first plate element and the second plate element to internal pressure by introducing an active medium into the space and forming a channel in at least one plate element of the first plate element or the second plate element;
• melting the solder material between the first plate element and the second plate element, and soldering the first plate element and the second plate element on joining surfaces in contact and soldering the connecting piece with the first plate element;
• and
• opening the heat forming soldering tool and removing the temperature control plate from the heat forming soldering tool.