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US 2025/0358929 A1Published application
Connection circuit and method of manufacturing connection circuit
AssigneeYazaki Corporation
InventorMasafumi WATANABE
Life of this patent
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Abstract
A connection circuit includes a base material, and circuits printed on the base material with conductive ink, in which a part of the base material is folded; at least parts of the circuits are layered in a vertical direction in a plan view; and the base material is interposed between the circuits in the vertical direction.
Claims5
A connection circuit comprising:
- a base material having electrical insulation properties;
- and
- circuits printed on the base material with conductive ink;
- wherein:
- a part of the base material is folded, and at least parts of the circuits are layered in a vertical direction in a plan view;
- and
- the base material is interposed between the circuits in the vertical direction in a side view.
4 more elements
A method of manufacturing a connection circuit comprising a base material having electrical insulation properties, and circuits printed on the base material with conductive ink, comprising:
- a step of printing circuits on the base material with conductive ink;
- a step of punching out a part of the base material so that the base material comprises joint parts, and a plurality of divided base materials connected by the joint parts;
- and
- a step of folding and arranging the joint parts so that at least parts of circuits printed on the plurality of divided base materials are layered in a vertical direction in a plan view, and interposing the base material between the circuits in the vertical direction in a side view.
1 more element
Dependencies are inferred from the claim text.