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US 2025/0357427 A1Published application
Packages with multiple types of underfill and method forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou
Life of this patent
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Abstract
A method includes bonding a first package component over a second package component, dispensing a first underfill between the first package component and the second package component, and bonding a third package component over the second package component. A second underfill is between the third package component and the second package component. The first underfill and the second underfill are different types of underfills.
Claims20
A package comprising:
- an interposer;
- a plurality of device dies over and bonded to the interposer, wherein the plurality of device dies comprises:
- a first device die;
- and
- a second device die, a third device die, a fourth device die, and a fifth device die surrounding the first device die;
- a first underfill between the first device die and the interposer;
- a second underfill different from the first underfill, wherein the second underfill comprises:
- a first portion, wherein in a top view of the package, the first portion is between the second device die and the third device die and fully fills a first space between the second device die and the third device die;
- and
- a second portion and a third portion, both in a second space between the fourth device die and the fifth device die in the top view;
- and
- a molding compound, wherein in the top view, the molding compound comprises a portion in the second space and separating the second portion from the third portion of the second underfill.
9 more elements
A package comprising:
- a first package component;
- a second package component over and electrically coupled to the first package component;
- a first underfill comprising a part in a first gap between the second package component and the first package component;
- a third package component over and electrically coupled to the first package component, wherein in a top view of the package, the first underfill encircles, and forms rectangular interfaces with, both of the second package component and the third package component;
- and
- a second underfill in a second gap between the third package component and the first package component, wherein the first underfill encircles the second underfill, and forms a distinguishable interface with the second underfill, and wherein the second underfill comprises a base material, and filler particles in the base material.
3 more elements
A package comprising:
- an interposer;
- a plurality of device dies over and bonded to the interposer, wherein the plurality of device dies comprises:
- a first die;
- and
- a second die, a third die, a fourth die, and a fifth die surrounding the first die;
- a non-conductive film between the interposer and the first die;
- a capillary underfill comprising:
- a first portion, wherein in a top view of the package, the first portion fully fills a first space between the second die and the third die;
- a second portion, wherein in the top view of the package, the second portion partially fills a second space between the fourth die and the fifth die;
- and
- a third portion encircling and forming a rectangular interface ring with the first die;
- and
- an encapsulant encapsulating the plurality of device dies, wherein the encapsulant further surrounds the non-conductive film and the capillary underfill.
10 more elements
Dependencies are inferred from the claim text.