Chip package structure with redistribution layer having bonding portion

A chip package structure, comprising:

• a first redistribution layer having a first bonding portion, wherein the first bonding portion comprises a first dielectric layer and a first conductive pad in the first dielectric layer;
• a chip structure bonded to the first bonding portion, wherein the chip structure comprises a semiconductor substrate, a second dielectric layer and a second conductive pad in the second dielectric layer, the second dielectric layer is between and connected to the first dielectric layer and the semiconductor substrate, and the first conductive pad is connected to the second conductive pad;
• and
• a protective layer over the first redistribution layer and surrounding the chip structure, wherein the protective layer has a first portion and a second portion, the first portion extends into the first redistribution layer and surrounds the first bonding portion, and the second portion extends into the second dielectric layer from a first sidewall of the second dielectric layer.