Coil shield of a capacitance module

A capacitance module, comprising:

• a touch electrode on a first surface of the capacitance module;
• an inductance coil deposited on a second surface of the capacitance module;
• and
• a magnetic iron material positioned between the inductance coil and the first surface.

A capacitance module, comprising:

• a touch electrode on a first surface of the capacitance module;
• a first portion of an inductance coil deposited on a second surface of the capacitance module;
• a second portion of the inductance coil deposited on a third surface of the capacitance module;
• a first coil shield deposited on the second surface of the capacitance module;
• and
• a second coil shield deposited on the third surface of the capacitance module;
• a magnetic iron material positioned between the first portion of the inductance coil and the first surface;
• wherein the first portion of the inductance coil and the second portion of the inductance coil are electrically connected;
• wherein the inductance coil is positioned to interact with a magnet adjacent to the inductance coil;
• wherein the first coil shield and the second coil shield are positioned to reduce electromagnetic interference between the inductance coil and other electronic components of the capacitance module.

A capacitance module, comprising:

• at least one touch electrode on a first surface of the capacitance module;
• a first inductance coil;
• a second inductance coil;
• a magnetic iron material positioned between the inductance coil and the first surface;
• and
• wherein a first portion of the first inductance coil is deposited on a second surface of the capacitance module and a second portion of the first inductance coil is deposited on a third surface of the capacitance module;
• wherein a first portion of the second inductance coil is deposited on the second surface of the capacitance module and a second portion of the second inductance coil is deposited on the third surface of the capacitance module;
• a first shield is deposited on the second surface and a second coil shield is deposited on the third surface of the capacitance module, the first coil shield and the second coil shield being positioned to reduce electromagnetic interference between the first inductance coil, the second inductance coil, and other electronic components of the capacitance module;
• wherein the first inductance coil is positioned to interact with a first magnet adjacent to the first inductance coil;
• and
• wherein the second inductance coil is positioned to interact with a second magnet adjacent to the second inductance coil.