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US 2025/0355174 A1Published application
Optical device and method of manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsing-Kuo Hsia, Jui Lin Chao, Chen-Hua Yu, Chih-Hao Yu, Shih-Peng Tai
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Abstract
Optical devices and methods of manufacture are presented in which a laser die or other heterogeneous device is embedded within an optical device and evanescently coupled to other devices. The evanescent coupling can be performed either from the laser die to a waveguide, to an external cavity, to an external coupler, or to an interposer substrate.
Claims20
A method of manufacturing an optical device, the method comprising:
- forming a laser diode electrically connected to first external connectors;
- depositing a gap fill material around the laser diode;
- and
- forming a first layer of optical components, the first layer of optical components comprising a first external coupler;
- bonding the first external connectors to a first interposer;
- forming an optical interposer electrically connected to second external connectors;
- bonding a first semiconductor device to the optical interposer;
- and
- forming a second layer of optical components, the second layer of optical components comprising a second external coupler;
- and
- bonding the second external connectors to the first interposer such that, after the bonding the second external connectors, the first external coupler to be aligned with the second external coupler.
8 more elements
A method of manufacturing an optical device, the method comprising:
- forming a laser die with a laser diode;
- forming an external cavity separately from the laser diode;
- bonding the laser die to an optical interposer, wherein after the bonding the laser diode is coupled with the external cavity;
- and
- bonding a first semiconductor device to the optical interposer.
2 more elements
A method of manufacturing an optical device, the method comprising:
- forming a transmission device, the forming the transmission device comprising:
- forming a laser diode;
- depositing a gap fill material around the laser diode;
- and
- forming a first layer of optical components, the first layer of optical components comprising a first external coupler;
- forming a receiving device, the forming the receiving device comprising:
- forming an optical interposer;
- bonding a first semiconductor device to the optical interposer;
- and
- forming a second layer of optical components, the second layer of optical components comprising a second external coupler;
- and
- bonding the transmission device and the receiving device to an interposer substrate, wherein after the bonding the transmission device and the receiving device the first external coupler is aligned with the second external coupler.
9 more elements
Dependencies are inferred from the claim text.