Cooling flow in substrate processing according to predicted cooling parameters
AssigneeApplied Materials, Inc.
InventorsAla Moradian, Umesh Kelkar, Orlando Trejo, Elizabeth Kathryn Neville, Karthik Ramanathan
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Abstract
A method includes inputting data associated with a process recipe into a model representative of thermal characteristics of a processing chamber. The method further includes receiving, via the model, predicted data associated with a flow of coolant for cooling the processing chamber. The method further includes causing cooling of the processing chamber based on the predicted data.
Claims20
A method, comprising:
- inputting data associated with a process recipe into a model representative of thermal characteristics of a processing chamber;
- receiving, via the model, predicted data associated with a flow of coolant for cooling the processing chamber;
- and
- causing cooling of the processing chamber based on the predicted data.
A system, comprising:
- a processing chamber configured to process a substrate;
- a processing device configured to:
- input data associated with a process recipe into a model representative of thermal characteristics of the processing chamber;
- receive, via the model, predicted data associated with a flow of coolant for cooling the processing chamber;
- and
- cause cooling of the processing chamber based on the predicted data.
A non-transitory machine-readable storage medium comprising instructions that, when executed by a processing device, cause the processing device to:
- input data associated with a process recipe into a model representative of thermal characteristics of a processing chamber;
- receive, via the model, predicted data associated with a flow of coolant for cooling the processing chamber;
- and
- cause cooling of the processing chamber based on the predicted data.
Dependencies are inferred from the claim text.