Back to results
US 2025/0354092 A1Published application
Cleaning composition and method for removing polymer film bonding materials using the same
AssigneeHongyue Advanced Technology Co., Ltd.
InventorYing-Hao Li
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a cleaning composition and a method for removing residual polymer film bonding materials on a carrier after mechanical debonding or laser debonding using the same, wherein the cleaning composition at least includes component (A) alkali metal hydroxide (weight percentage concentration: 5%-30%), component (B) polar aprotic solvent (weight percentage concentration: 5%-50%), component (C) co-solvent (weight percentage concentration: 5%-60%) and component (D) water.
Claims19
A cleaning composition for removing polymer film bonding materials, comprising:
- an alkali metal hydroxide;
- a polar aprotic solvent;
- a co-solvent;
- and
- water.
2 more elements
Dependencies are inferred from the claim text.