Composition for adhesion of dissimilar materials, and preparation method therefor
AssigneeSamyang Corporation
InventorsJae Hoon LEE, Hoon RYU, Jun Seop IM
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AssigneeSamyang Corporation
InventorsJae Hoon LEE, Hoon RYU, Jun Seop IM
Estimating the term…
The present invention relates to a composition for adhesion of dissimilar materials, and a preparation method therefor, and, more specifically, to a composition for adhesion of dissimilar materials, and a preparation method therefor, the composition comprising, in a specific weight ratio, a (meth)acrylic monomer, an epoxy resin, an epoxy curing accelerator, a thermal polymerization initiator, a polymerization inhibitor and a (meth)acrylic-modified polyurethane component, which comprises a hydrophilic (meth)acrylic-modified polyurethane and a lipophilic (meth)acrylic-modified polyurethane, and having excellent oil resistance while enabling high adhesiveness to be implemented between dissimilar materials at room temperature and high temperatures.
A composition for bonding heterogeneous materials comprising, based on total 100 parts by weight of the composition,
A method for preparing a composition for bonding heterogeneous materials, comprising the step of mixing, based on total 100 parts by weight of the composition, 25.5 to 84.5 parts by weight of a (meth)acryl-modified polyurethane component comprising hydrophilic (meth)acryl-modified polyurethane and lipophilic (meth)acryl-modified polyurethane;
Dependencies are inferred from the claim text.