Water-soluble adhesive composition for component capture, water-soluble adhesive sheet for component capture, and method for producing electronic component

Abstract

An object of the present invention is to provide a water-soluble adhesive composition for component capture and a water-soluble adhesive sheet for component capture which are superior in the impact absorption and the stickiness and adhesiveness and suitable for capturing components, and provide a method which allows high-precision, efficient production of electronic components, by using the composition and the sheet. To achieve the object, a composition and a sheet including the composition are provided, the composition containing an (A) water-soluble adhesive and a (B) water-soluble plasticizer (excluding the component (A)), wherein the (B) water-soluble plasticizer has 50000 mPa·s or less at normal temperature (25° C.), and a ratio of a content of the (B) water-soluble plasticizer to a content of the (A) water-soluble adhesive ((B)/(A)) is greater than 0.5 and 3.0 or less. According to the present invention, impact absorption and the stickiness and adhesiveness are improved, and particularly in the production of a semiconductor element, damage or misalignment of a component (element) is reduced. Particularly the sheet of the present invention is easy to handle in attachment and peeling.

Dependencies are inferred from the claim text.