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US 2025/0354028 A1Published application
Dielectric, copper-clad laminate and method for producing same
AssigneeDaikin Industries, Ltd.
InventorsShingo OKUNO, Yuki UEDA, Moe HOSOKAWA, Kyohei SAWAKI, Yoshito TANAKA, Akiyoshi YAMAUCHI, Yosuke KISHIKAWA
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Abstract
A dielectric that has excellent electrical characteristics and causes no blistering of a copper foil during production of a copper-clad laminate using the dielectric, and a method for producing the same are provided. Further, a copper-clad laminate using the dielectric, and a method for producing the same are provided. The dielectric has a residual organic matter content of 500 μg/g or less. The metal-clad laminate has the dielectric and a metal foil.
Claims23
A dielectric, having a residual organic matter content of 500 μg/g or less.
Dependencies are inferred from the claim text.