Low temperature curing compositon for rubber based adhesives and sealants
AssigneeHenkel AG & Co. KGaA
InventorsPaul D. Zeits, Gail M. Henning, Erica Elizabeth Gibbons
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Abstract
The invention relates to a rubber-based composition that can be thermally cured at reduced temperature while retaining performance over a broad cure temperature window comprising at least one solid rubber, at least one diene-based polymer or copolymer containing an olefinic double bond and/or an aromatically substituted olefin, suitable for undergoing curing with a curing system present as quinone dioxime, peroxides and optional multifunctional acrylates, preferably in the absence of elemental sulfur. The cured composition exhibits improved reversion resistance and adhesion strength on aluminum.
Claims19
A thermally curable composition, comprising:
- a component (a) comprising:
- (a1) a solid rubber;
- (a2) an olefinic double bond-containing polymer which is liquid or pasty at 22° C.;
- (a3) a processing oil;
- and
- (a4) a liquid polydiene different from (a1-a3);
- and
- a component (b) a vulcanizing system comprising two or more of:
- (b1) quinone dioxime;
- (b2) an organic peroxide and
- (b3) a multifunctional coagent comprising a monomer, oligomer or polymer having a plurality of α,β-unsaturated carbonyl functional groups.
9 The thermally curable composition according to claim 1, wherein (b3) the multifunctional coagent comprising a monomer, oligomer or polymer having a plurality of α,β-unsaturated carbonyl functional groups includes at least one tri-functional (meth)acrylate.
Dependencies are inferred from the claim text.