Bonding of structures using high intensity focused ultrasound (hifu)
AssigneesMichael W. Pinch, University of Washington, Pinch Engineering PLLC
InventorsMichael PINCH, Thomas J. MATULA, Ekaterina KUZNETSOVA, Adam D. MAXWELL, Cody BIRKLAND, Amy Jean SWANSON
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Abstract
Methods and systems for bonding of structures using high intensity focused ultrasound are disclosed. In one embodiment, a method for assembling components using ultrasound includes: positioning a first part of an assembly with respect to a second part of the assembly; heating a region of the assembly by focusing the ultrasound from an ultrasound transducer to the region of the assembly; and, in response to heating the region of the assembly, bonding the first part of the assembly to the second part of the assembly.
Claims24
A method for assembling components using an ultrasound, the method comprising:
- positioning a first part of an assembly with respect to a second part of the assembly;
- heating a region of the assembly by focusing the ultrasound from an ultrasound transducer to the region of the assembly, wherein heating of the region is based on transferring ultrasound acoustic energy into heat via absorption of ultrasound acoustic energy at a focal zone corresponding to the region of the assembly;
- and
- in response to heating the region of the assembly, bonding the first part of the assembly to the second part of the assembly.
A system for assembling components using an ultrasound, comprising:
- an ultrasound transducer configured for transmitting the ultrasound toward an assembly having a first part and a second part,
- wherein the ultrasound is configured for heating a region of the assembly by focusing the ultrasound from the ultrasound transducer to the region of the assembly, wherein heating of the region is based on transferring ultrasound acoustic energy into heat via absorption of ultrasound acoustic energy at a focal zone corresponding to the region of the assembly, and
- wherein, in response to heating the region of the assembly, the first part of the assembly to the second part of the assembly are bonded.
Dependencies are inferred from the claim text.