Light emitting module having molding layer including light diffusion layer and black molding layer and display device having the same
AssigneeSeoul Viosys Co., Ltd.
InventorsJunhong MIN, Ik Kyu YOU
Life of this patent
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Abstract
A method of manufacturing a light emitting module includes mounting a plurality of unit pixels on a module substrate, thermally curing a light diffusion film and a black film, laminating the light diffusion film and the black film, forming a molding layer to surround side surfaces of the plurality of unit pixels by disposing the laminated light diffusion film and the black film on the module substrate, and pressing the light diffusion film and the black film; and cutting and removing edges of the module substrate and the molding layer. The molding layer includes a light diffusion layer and a black molding layer disposed on the light diffusion layer.
Claims18
A light emitting module, comprising:
- a module substrate including pads;
- a protection layer disposed on the module substrate and exposing portions of the module substrate and the pads, the protection layer configured to block soldering of the pads and prevent an electrical short circuit between the pads;
- a plurality of emitters disposed on the module substrate, each of the plurality of emitters including a connection electrode electrically connected to the pads and a semiconductor layer;
- a light diffusion layer disposed on the module substrate;
- and
- a black layer disposed on the module substrate,
- wherein a thickness of the black layer is smaller than a thickness of the light diffusion layer;
- at least one of the light diffusion layer or the black layer includes one or more patterns, and
- a side surface of the module substrate and a side surface of the black layer are located on a same plane.
A light emitting module, comprising:
- a module substrate including a pad;
- a protection layer disposed on the module substrate and exposing a portion of the module substrate and a portion of the pad;
- a plurality of emitters disposed on the module substrate, each of the plurality of emitters including a connection electrode electrically connected to the pad and a semiconductor layer;
- a light diffusion layer disposed on the module substrate;
- and
- a black layer disposed on the pad,
- wherein a thickness of the black layer is smaller than a thickness of the light diffusion layer;
- at least one of the light diffusion layer or the black layer includes one or more patterns, and
- a side surface of the module substrate and a side surface of the black layer are located on a same plane.
A light emitting module, comprising:
- a module substrate including a pad;
- a protection layer disposed on the module substrate and exposing a portion of the module substrate and a portion of the pad;
- a plurality of emitters disposed on the module substrate, each of the plurality of emitters including a connection electrode electrically connected to the pad and a semiconductor layer;
- a light diffusion layer disposed on the module substrate;
- and
- a black layer disposed on the module substrate,
- wherein a thickness of the black layer is smaller than a thickness of the light diffusion layer;
- at least one of the light diffusion layer or the black layer includes one or more patterns, and
- a side surface of the module substrate and a side surface of the black layer are located on a same plane.
Dependencies are inferred from the claim text.