Reflow soldering method and electronic circuit board assembly system

A reflow soldering method for manufacturing an electronic circuit board comprising a first component and a second component, wherein the first component has a first thermal mass and the second component has a second thermal mass and wherein the second thermal mass is greater than the first thermal mass, the reflow soldering method comprising:

• applying a solder paste to a substrate to be soldered;
• applying a first component to the substrate;
• applying a second component to the substrate;
• applying a cover that is configured to reduce the transfer of heat to the first component to the substrate;
• forming a first solder joint between the first component and the substrate by heating the first component and the substrate using a heater;
• and
• forming a second solder joint between the second component and the substrate by heating the second component and the substrate using the heater.

An electronic circuit board assembly system comprising:

• an electronic circuit board assembly comprising:
• a substrate;
• a first component having a first thermal mass;
• and
• a second component having a second thermal mass, wherein the second thermal mass is greater than the first thermal mass;
• wherein the first component and the second component are adhered to the substrate by a solder paste;
• and
• wherein the electronic circuit board assembly system comprises a reflow convection oven that is configured to heat the first component, the second component and the substrate;
• and,
• wherein the electronic circuit board assembly system comprises a secondary heater that is configured to heat the second component.

An electronic circuit board assembly system comprising:

• an electronic circuit board assembly comprising:
• a substrate;
• a first component having a first thermal mass;
• and
• a second component having a second thermal mass, wherein the second thermal mass is greater than the first thermal mass;
• wherein the first component and the second component are adhered to the substrate by a solder paste;
• and
• wherein the electronic circuit board assembly system comprises a reflow convection oven that is configured to heat the first component, the second component and the substrate;
• and,
• wherein the electronic circuit board assembly comprises a cover that is configured to reduce the transfer of heat from the reflow convection oven to the first component.