Contactless interconnection between pcb and antenna assembly
AssigneeGapwaves AB
InventorsCarlo BENCIVENNI, Abbas Vosoogh
Life of this patent
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AssigneeGapwaves AB
InventorsCarlo BENCIVENNI, Abbas Vosoogh
Estimating the term…
The present disclosure relates to an antenna arrangement (10) comprising a PCB (1) a plurality of solder balls (16) soldered on the first major surface (la) of the PCB (1), the PCB (1) further comprising a conductive layer (12a) connecting the solder balls (16) at their bases. The antenna arrangement further comprises an antenna module (2) comprising a second major surface (2b) which is electrically conductive and at least one waveguide opening (23) and at least one antenna aperture (22), wherein the antenna module (2) is arranged with the second major surface (2b) facing the PCB (1). The solder balls (16) are arranged to form an EBG structure together with the conductive second major surface (2b) of the antenna module (2) and the conductive layer of the first major surface (la) of the PCB (1), and the antenna arrangement (10) further comprises a transmitting and/or receiving component (3).
An antenna arrangement comprising:
(canceled)
Dependencies are inferred from the claim text.