Imaging element and imaging device
AssigneeSony Semiconductor Solutions Corporation
InventorDaizo Takata
Life of this patent
Estimating the term…
Abstract
A reduction in the visibility of an alignment mark of an imaging device configured by bonding a plurality of semiconductor substrates together is prevented. An imaging element includes a semiconductor substrate, a pad, an alignment mark, and a light shielding film. The semiconductor substrate includes a pixel region which is a region in which pixels for generating an image signal in accordance with incident light are disposed. The pad is disposed on a surface side of the semiconductor substrate. The alignment mark is disposed on a back surface side of the semiconductor substrate. The light shielding film is disposed between the pad and the alignment mark.
Claims14
An imaging element comprising:
- a semiconductor substrate that includes a pixel region which is a region in which pixels for generating an image signal in accordance with incident light are disposed;
- a pad that is disposed on a surface side of the semiconductor substrate;
- an alignment mark that is disposed on a back surface side of the semiconductor substrate;
- and
- a light shielding film that is disposed between the pad and the alignment mark.
An imaging device comprising:
- an imaging element including a semiconductor substrate that includes a pixel region which is a region in which pixels for generating an image signal in accordance with incident light are disposed,
- a pad that is disposed on a surface side of the semiconductor substrate,
- an alignment mark that is disposed on a back surface side of the semiconductor substrate, and
- a light shielding film that is disposed between the pad and the alignment mark;
- and
- a processing circuit that processes the generated image signal.
Dependencies are inferred from the claim text.