Patterned deep trench isolation for passive devices

Abstract

An electronic device and related method of fabricating such a device includes an electrically-conductive passive device (e.g., an inductor or transmission line) fabricated above an upper surface of a semiconductor substrate that has a body portion disposed between the upper surface and a lower surface of the substrate. The body portion is doped n-type or p-type and the passive device is separated from the upper surface by one or more layers of electrically insulating material. The substrate includes a set of electrically-insulating isolation trenches disposed beneath the passive device that extend from the upper surface of the substrate toward the lower surface of the substrate and the isolation trenches are disjoint from each other.

Dependencies are inferred from the claim text.