Radio frequency chip arrangement, sensor and method of manufacture

Abstract

A radio frequency chip arrangement is provided, including: a radio frequency chip configured to emit and to receive radio frequency waves; a first housing having a cavity, including a housing cover and a carrier substrate, the first housing surrounding the radio frequency chip when the housing cover is attached to the carrier substrate, the radio frequency chip being arranged on a top surface of the carrier substrate so as to radiate the radio frequency waves away from the carrier substrate, and the carrier substrate, the radio frequency chip, and the first housing form a module; and a second housing, which surrounds at least the module, an intermediate space between the module and the second housing being filled with a potting compound, so that the module is completely surrounded by the potting compound and the radio frequency waves pass through the first housing, the potting compound, and the second housing.

Dependencies are inferred from the claim text.