Semiconductor package structure and method for forming the same
AssigneeMediatek Inc.
InventorChin-Chiang CHANG
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Abstract
A semiconductor package structure and a method for forming the same are provided. The semiconductor package structure includes a semiconductor die and a conductive adhesive layer. The semiconductor die includes a semiconductor substrate, a semiconductor substrate and a through via. The semiconductor substrate has a first surface and a second surface. The semiconductor device is formed on the first surface of the semiconductor substrate. The through via is formed in such a way that it passes through the semiconductor substrate. The conductive adhesive layer is disposed on the second surface of the semiconductor substrate. The through via is coupled to the conductive adhesive layer.
Claims20
A semiconductor package structure, comprising:
- a semiconductor die, comprising:
- a semiconductor substrate having a first surface and a second surface;
- a semiconductor device formed on the first surface of the semiconductor substrate;
- and
- a through via formed in such a way that it passes through the semiconductor substrate;
- and
- a conductive adhesive layer disposed on the second surface of the semiconductor substrate, wherein the through via is coupled to the conductive adhesive layer.
A method for forming a semiconductor package structure, comprising:
- providing a semiconductor wafer, wherein the semiconductor wafer comprises:
- a semiconductor substrate having a first surface and a second surface;
- a semiconductor device formed on the first surface of the semiconductor substrate;
- and
- a through via extending from above the first surface of the semiconductor substrate into a portion of the semiconductor substrate;
- removing a portion of the semiconductor substrate from the second surface until the through via has a protruding portion that protrudes from the semiconductor substrate;
- and
- forming a conductive adhesive layer on the second surface of the semiconductor substrate.
Dependencies are inferred from the claim text.