Heat dissipation structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYun-Wei CHENG, Chun-Hao Chou, Kuo-Cheng Lee, Ying-Hao Chen
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Abstract
The present disclosure describes heat dissipation structures formed in functional or non-functional areas of a three-dimensional chip structure. These heat dissipation structures are configured to route the heat generated within the three-dimensional chip structure to designated areas on or outside the three-dimensional chip structure. For example, the three-dimensional chip structure can include a plurality of chips vertically stacked on a substrate, a first passivation layer interposed between a first chip and a second chip of the plurality of chips, and a heat dissipation layer embedded in the first passivation layer and configured to allow conductive structures to pass through.
Claims20
A structure, comprising:
- a first chip, comprising:
- a first substrate, and
- a first multi-level electrically conductive structure disposed on the first substrate;
- a second chip, comprising:
- a second substrate,
- a second multi-level electrically conductive structure disposed on the second substrate, and
- a multi-level thermally conductive structure disposed on the second substrate;
- a dielectric layer between the first and second chips;
- and
- a mesh-type heat dissipation layer disposed in the dielectric layer.
A structure, comprising:
- a substrate;
- a first dielectric layer disposed on the substrate;
- a multi-level heat dissipation layer disposed in the first dielectric layer;
- a multi-level electrically conductive structure disposed on the multi-level heat dissipation layer;
- a heat dissipation layer with openings disposed on the first multi-level electrically conductive structure;
- and
- a multi-level thermally conductive structure disposed on the heat dissipation layer.
A structure, comprising:
- a substrate;
- a first metallization layer comprising a first metal line disposed on the substrate;
- a second metallization layer comprising:
- a second metal line disposed on the first metallization layer, and
- a thermally conductive line disposed on the first metallization layer;
- a dielectric layer disposed between the first and second metallization layers;
- and
- a heat dissipation layer with openings disposed in the dielectric layer.
Dependencies are inferred from the claim text.