Back to results
US 2025/0310001 A1Published application
Interconnect networks using microled-based optical links
AssigneeAvicenaTech, Corp.
InventorsRobert Kalman, Bardia Pezeshki, Alexander ` Tselikov, Cameron Danesh
Life of this patent
Estimating the term…
Abstract
Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.
Claims14
Optical interconnections for integrated circuit chips, comprising:
- a plurality of substrates;
- a plurality of integrated circuit chips on the plurality of substrates;
- a plurality of vertically launched parallel optical links (VLPOLs) optically interconnecting at least some of the integrated circuit chips;
- and
- a plurality of planar launched parallel optical links (PLPOLs) optically interconnecting at least some of the integrated circuit chips.
2 more elements
Optically interconnected integrated circuit chips, comprising:
- a plurality of substrates, each substrate defining a different plane, the different planes being parallel to one another;
- a plurality of integrated circuit chips on the plurality of substrates;
- a plurality of optoelectronic devices mounted to active sides of at least some of the plurality of integrated circuit chips, the optoelectronic devices including microLEDs and photodetectors, the at least some of the plurality of integrated circuit chips including microLED driver circuitry and receiver circuitry;
- and
- a plurality of multicore fibers optically interconnecting the microLEDs and the photodetectors mounted to the at least some of the integrated circuit chips on substrates defining different planes.
2 more elements
Dependencies are inferred from the claim text.