Using laser based system for mean of shaping of unsingulated & singulated dies by substrate lattice manipulation
AssigneeTokyo Electron Limited
InventorsDavid CONKLIN, Anthony SCHEPIS, Anton DEVILLIERS
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Abstract
Aspects of the present disclosure provide a method for correcting distortion of a semiconductor substrate. For example, the method can include receiving a semiconductor substrate with distortion, measuring the semiconductor substrate to identify the distortion in a plurality of positions on the semiconductor substrate, and implanting into the semiconductor substrate a lattice configuration signature according to the identified distortion in the positions such that the identified distortion of the semiconductor substrate is corrected.
Claims20
A method for correcting distortion of a semiconductor substrate, comprising:
- receiving a semiconductor substrate with distortion;
- measuring the semiconductor substrate to identify the distortion in a plurality of positions on the semiconductor substrate;
- and
- implanting into the semiconductor substrate a lattice configuration signature according to the identified distortion in the positions on the semiconductor substrate such that the identified distortion of the semiconductor substrate is corrected.
An apparatus for correcting distortion of a semiconductor substrate, comprising:
- a distortion measurement device configured to measure the semiconductor substrate to identify the distortion in a plurality of positions on the semiconductor substrate;
- a light source configured to implant a lattice configuration signature into the semiconductor substrate to distort the semiconductor substrate;
- and
- a controller coupled to the distortion measurement device and the light source, the controller configured to control the light source to implant the lattice configuration signature into the semiconductor substrate according to the identified distortion in the positions on the semiconductor substrate.
Dependencies are inferred from the claim text.