Component Carrier and Manufacturing Method

A method of manufacturing a component carrier, comprising:

• providing a stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure;
• providing a stack side wall to the stack, wherein at least a portion thereof is tapered with respect to the stacking direction;
• and
• providing at least one inorganic layer structure to the stack, wherein the inorganic layer structure is formed to be laterally exposed and forming at least partially the stack side wall.

A method of manufacturing a component carrier, the method comprising:

• providing a component carrier preform;
• separating the component carrier preform into a plurality of component carriers,
• providing at least one component carrier with a stack of at least one electrically insulating layer structure, at least one electrically conductive layer structure, a stack side wall with at least a portion that is tapered with respect to a stacking direction of the component carrier and at least one inorganic layer structure being laterally exposed at the stack side wall;
• and/or
• providing a stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure;
• providing a stack side wall to the stack, wherein at least a portion thereof is tapered with respect to the stacking direction;
• and
• providing at least one inorganic layer structure to the stack, wherein the inorganic layer structure is laterally exposed and forms at least partially the stack side wall.