Copper foil with resin, and copper-clad laminate and printed wiring board using the same

A copper foil with resin, comprising:

• an uncured or semi-cured thermosetting resin layer;
• and
• a copper foil, wherein
• the thermosetting resin layer comprises a thermosetting resin composition comprising:
• (A) a maleimide compound having one or more hydrocarbon groups derived from a dimer acid skeleton in one molecule;
• and
• (B) one or more catalysts selected from the group consisting of a thermal radical polymerization initiator and an anionic polymerization initiator, and
• the maleimide compound of the component (A) is one or more compounds selected from the group consisting of the following formulae (1), (2), and (3), one or more compounds of the component (A) is solid at 25° C., and a ten-point average roughness (Rz) of a surface of the copper foil, the surface which contacts the thermosetting resin layer, is 1.5 μm or less,
• wherein “A” independently represents a tetravalent organic group having a cyclic structure;
• “B” independently represents a divalent hydrocarbon group having 6 to 60 carbon atoms and excluding a group having a dimer acid skeleton;
• “D” independently represents a group selected from the group consisting of a divalent aliphatic hydrocarbon group having 6 to 60 carbon atoms and a divalent aromatic hydrocarbon group having 6 to 60 carbon atoms, and one or more groups of “D” are a hydrocarbon group derived from a dimer acid skeleton;
• m1 represents 1 to 100;
• m2 represents 1 to 200;
• and an order of repeating units enclosed by parentheses subscripted with m1 and m2 is not limited, and a bonding manner may be alternate, in blocks, or at random,
• wherein “A” and “D” represent the same as defined above;
• one or more groups of “D” are a hydrocarbon group derived from a dimer acid skeleton;
• and “n” represents 1 to 100,
• wherein “D” represents the same as defined above.