Electronic device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWei-Hao CHANG, Yi Chun CHOU
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Abstract
The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes a pliable encapsulant, a first electronic component, and a first conductive connection. The pliable encapsulant has a first predetermined pattern. The first electronic component includes a terminal exposed by the first predetermined pattern. The first conductive connection is disposed within the first predetermined pattern and electrically connected to the terminal of the first electronic component.
Claims20
An electronic device, comprising:
- a pliable encapsulant having a first predetermined pattern;
- a first electronic component disposed within the pliable encapsulant, wherein the first electronic component comprises a terminal exposed by the first predetermined pattern;
- and
- a conductive connection disposed within the first predetermined pattern and electrically connected to the terminal of the first electronic component.
An electronic device, comprising:
- a pliable encapsulant having a first surface and a second surface opposite to the first surface;
- a first conductive connection recessed from the second surface;
- and
- a second conductive connection recessed from the first surface and electrically connected to the first conductive connection.
A method of manufacturing an electronic device, comprising:
- providing a first electronic component and an encapsulant encapsulating the first electronic component;
- forming a first predetermined pattern defined by the encapsulant;
- and
- forming a first conductive connection within the first predetermined pattern of the encapsulant to be electrically connected to the first electronic component.
Dependencies are inferred from the claim text.