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US 2025/0293192 A1Published application
Film-form adhesive, adhesive film, integrated dicing/die bonding film, and method for manufacturing semiconductor device
AssigneeResonac Corporation
InventorsMichiko KAYA, Shota AOYAGI, Noriyuki NAKAYAMA, Mikiko KIMURA
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Abstract
A film-like adhesive containing a thermosetting resin component; and a filler, in which the film-like adhesive has a single layer structure including a first surface and a second surface, and has a region in a vicinity of the first surface, the region in which a content rate of the filler decreases in a direction from the second surface toward the first surface.
Claims20
A film-like adhesive comprising:
- a thermosetting resin component;
- and
- a filler,
- wherein the film-like adhesive has a single layer structure comprising a first surface and a second surface, and
- wherein the film-like adhesive has a region in a vicinity of the first surface, the region in which a content rate of the filler decreases in a direction from the second surface toward the first surface.
2 more elements
A film-like adhesive comprising:
- a thermosetting resin component;
- and
- a filler,
- wherein the film-like adhesive has a single layer structure comprising a first surface and a second surface, and
- wherein the film-like adhesive, after being cured by heating, has a region in a vicinity of the first surface, the region in which a content rate of the filler decreases in a direction from the second surface toward the first surface.
2 more elements
Dependencies are inferred from the claim text.