Integrated circuit packages and methods of forming the same

An integrated circuit package, comprising:

• a first redistribution layer structure having a first side and a second side opposite to each other;
• and
• a first semiconductor die and a second semiconductor die electrically connected to the first side of the first redistribution layer structure,
• wherein a height of the first semiconductor die is less than a height of the second semiconductor die, and
• wherein a sidewall and a top of the first semiconductor die are encapsulated by different materials.

An integrated circuit package, comprising:

• a first redistribution layer structure having a first side and a second side opposite to each other;
• a first semiconductor die and a second semiconductor die electrically connected to the first side of the first redistribution layer structure;
• a first encapsulation layer encapsulating the first semiconductor die and a second semiconductor die;
• through vias penetrating through the first encapsulation layer and aside the first semiconductor die;
• and
• a third semiconductor die disposed over the first semiconductor die and electrically connected to the through vias,
• wherein a width of the third semiconductor die is greater than a width of the first semiconductor die.