Curable resin composition and electronic component device
AssigneeResonac Corporation
InventorsTomoo NISHIYAMA, Takaya YAMAMOTO, Ayako TAIRA
Life of this patent
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Abstract
The first curable resin composition contains a triphenylmethane epoxy resin having at least one selected from the group consisting of alkyl groups and alkoxy groups. The second curable resin composition contains a polysiloxane stress reliever and a triphenylmethane epoxy resin having at least one selected from the group consisting of alkyl groups and alkoxy groups. The third curable resin composition, when made into a cured product, has an elastic modulus at 260° C. of 400 MPa or less, a linear expansion coefficient at 180-200° C. of 32 ppm/° C. or more, and an adhesive strength of the cured product to Ag (silver) after treatment at 85° C. and 85% RH of 0.45 MPa or more.
Claims16
A curable resin composition, comprising a triphenylmethane type epoxy resin having at least one selected from a group consisting of an alkyl group and an alkoxy group.
A curable resin composition, having an elastic modulus at 260° C. of 400 MPa or less when made into a cured product, a linear expansion coefficient at 180° C. to 200° C. of 32 ppm/° C. or more when made into a cured product, and an adhesive strength of the cured product to Ag (silver) after treatment at 85° C. and 85% RH of 0.45 MPa or more.
Dependencies are inferred from the claim text.