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US 2025/0282920 A1Published application
Polymer film, laminate, wiring board, silsesquioxane polymer, and polymer composition
AssigneeFUJIFILM Corporation
InventorsDaisuke HAYASHI, Hiroshi INADA, Shohei YAMAZAKI
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Abstract
A polymer film including a silsesquioxane polymer, in which the polymer film has a dielectric loss tangent of 0.01 or less, and applications thereof.
Claims22
A polymer film comprising:
- a silsesquioxane polymer,
- wherein the polymer film has a dielectric loss tangent of 0.01 or less.
A laminate comprising:
- a layer A;
- and
- a layer B disposed on at least one surface of the layer A,
- wherein the layer B contains a silsesquioxane polymer, and
- the laminate has a dielectric loss tangent of 0.01 or less.
2 more elements
A silsesquioxane polymer,
- wherein the silsesquioxane polymer has a dielectric loss tangent of 0.01 or less.
Dependencies are inferred from the claim text.