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US 2025/0281963 A1Published application
Punching device and punching method using same
AssigneeSamsung SDI Co., Ltd.
InventorsSungsub SONG, Jaewook LEE
Life of this patent
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Abstract
A punching device includes: a die to receive a substrate disposed thereon; a stripper spaced apart from and facing the die, and to move toward the substrate to fix the substrate; and a punch to move toward the substrate and cut the substrate. The stripper includes: a punch accommodation portion to accommodate the punch; and a punching oil supply passage located inside the stripper, and to supply a punching oil to a side surface of the punch accommodation portion.
Claims20
A punching device comprising:
- a die configured to receive a substrate disposed thereon;
- a stripper spaced apart from and facing the die, and configured to move toward the substrate to fix the substrate;
- and
- a punch configured to move toward the substrate and cut the substrate,
- wherein the stripper comprises:
- a punch accommodation portion configured to accommodate the punch;
- and
- a punching oil supply passage located inside the stripper, and configured to supply a punching oil to a side surface of the punch accommodation portion.
5 more elements
A punching method comprising:
- supplying a substrate between a stripper and a die;
- supplying a punching oil to a side surface of a punch accommodation portion of the stripper through a punching oil supply passage located inside the stripper;
- and
- moving a punch and the stripper toward the substrate, such that the stripper fixes the substrate and the punch cuts the substrate,
- wherein a surface of the punch is disposed to face a side surface of the stripper.
2 more elements
Dependencies are inferred from the claim text.