Systems and methods for active and passive cooling of electrical components
AssigneeBorgWarner US Technologies LLC
InventorsKevin M. Gertiser, Chris Fruth
Life of this patent
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Abstract
A power module, includes: one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.
Claims20
A power module, comprising:
- one or more power switches;
- a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface, wherein the passive heat dissipation element comprises a first end and a second end;
- and
- an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element wherein the passive heat dissipation element is in direct contact with the active heat dissipation element between the first end and the second end.
A method for dissipating heat, the method comprising:
- dissipating at least a portion of heat generated at a power switch to a passive heat dissipation element in contact facing a first surface of the power switch;
- and
- dissipating at least a portion of the heat dissipated to the passive heat dissipation element to an active heat dissipation element in direct contact with and facing a second surface of the power switch via direct thermal contact between the passive heat dissipation element and the active heat dissipation element.
A power module, comprising:
- a heat generating electrical component;
- and
- a passive heat dissipation element in contact with and facing a first surface of the heat generating electrical component, the passive heat dissipation element comprising:
- a clamp structure;
- a contact interface;
- and
- a planar surface facing the heat generating electrical component, wherein the planar surface is connected to the clamp structure;
- wherein the clamp structure and the contact interface are in direct contact with an active heat dissipation element.
Dependencies are inferred from the claim text.