Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board

Abstract

An object is to provide a resin composition having a high permittivity and a low dissipation factor, and having excellent heat resistance and moisture absorption and heat resistance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition of the present invention contains (A) a surface coated titanium oxide in which a mass reduction rate in heating from 30° C. to 300° C. at a heating rate of 10° C./min is 0.5 mass % or less, and (B) a thermosetting compound.

Dependencies are inferred from the claim text.