High-frequency assembly for radar sensors
OwnerAndreas Kugler, Armin Himmelstossinventors
Life of this patent
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Abstract
A high-frequency assembly for radar sensors. The assembly includes a high-frequency component in the form of a package, which contains a semiconductor chip and, on its surface, has connections for contacting the semiconductor chip; a system board with conductor paths for controlling the package; and a waveguide structure for transmitting microwave signals to or from the package. The package is arranged on an adapter card, which itself is arranged on the system board and connects the package to the conductor paths of the system board, and the adapter card forms a microwave conductor structure, which is directly coupled to the waveguide structure.
Claims11
1-10. (canceled)
A high-frequency assembly for radar sensors, comprising:
- a high-frequency component in the form of a package, the package containing a semiconductor chip and, on a surface of the package, has connections for contacting the semiconductor chip;
- a system board with conductor paths for controlling the package;
- and
- a waveguide structure configured to transmit microwave signals to or from the package;
- wherein the package is arranged on an adapter card, the adapter card being arranged on the system board and connects the package to the conductor paths of the system board, and the adapter card forms a microwave conductor structure, which is directly coupled to the waveguide structure.
Dependencies are inferred from the claim text.