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AssigneeNational Cheng Kung University
InventorWen-Hsi Lee
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A method of sintering solderable base metals in air atmosphere and manufacturing alloy components to manufacture solderable electrodes by heat treatment instead of electroplating processes. The method involves introducing into an electrode plenty of metallic tin powder directly, then metallic aluminum powder with high-oxidation enthalpy formation to protect tin against oxidation, and other metals, say metallic copper powder, to produce copper-tin alloy to increase the melting point of the electrode. With the method, tin, as a base, directly functions as an electrode, covering the tin electrode with aluminum film to protect the tin electrode against oxidation during heat treatment, introducing appropriate metals, say copper, into the tin film to produce alloy from tin and copper to increase the melting point of the electrode. With electroplating processes replaced by heat treatment, electronic components, i.e., electrodes, are manufactured without any tin electroplating process but exhibit high solderability and excellent functionality.
A method of sintering solderable base metals in air atmosphere and manufacturing alloy components, comprising the steps of:
A method of manufacturing a chip alloy resistor comprising a base metal functioning as an alloy resistance layer, comprising the steps of:
Dependencies are inferred from the claim text.