Cap assembly, secondary battery including a cap assembly, and method of manufacturing a cap assembly
AssigneeSamsung SDI Co., Ltd.
InventorHyun Soo LEE
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Abstract
Disclosed are a cap assembly, a secondary battery including the a cap assembly, and a method of manufacturing the a cap assembly. The disclosed cap assembly and secondary battery can be made by the disclosed methods that reduce process difficulty and the process time, and provide improved cap assembly reliability. The cap assembly includes a lower conductive plate, an upper conductive plate disposed above the lower conductive plate, a lower resin layer fused to a bottom surface of the lower conductive plate, and an upper resin layer fused to a top surface of the lower conductive plate, a bottom surface of the upper conductive plate, or the top surface of the lower conductive plate and the bottom surface of the upper conductive plate.
Claims20
A cap assembly comprising:
- a lower conductive plate;
- an upper conductive plate disposed above the lower conductive plate;
- a lower resin layer fused to a bottom surface of the lower conductive plate;
- and
- an upper resin layer fused to a top surface of the lower conductive plate, a bottom surface of the upper conductive plate, or the top surface of the lower conductive plate and the bottom surface of the upper conductive plate.
A secondary battery comprising:
- an electrode assembly comprising a positive electrode plate, a negative electrode plate, and a separator film;
- a battery can comprising a receiving space in which the electrode assembly is received, with at least one end of the battery can being open;
- and
- at least one electrode terminal configured to close the open end of the battery can to seal the receiving space, the at least one electrode terminal being electrically connected to the electrode assembly,
- wherein the electrode terminal comprises a cap assembly comprising a pair of conductive plates and a pair of resin layers alternating with the pair of conductive plates.
A method of manufacturing a cap assembly, the method comprising:
- inserting a lower conductive plate, an upper conductive plate, and a gasket into a mold placed on a stage;
- moving the mold to a first injection area;
- forming an upper resin layer by injecting a first resin composition between the lower conductive plate and the upper conductive plate while maintaining the mold at a first temperature;
- moving the mold to a second injection area;
- forming a lower resin layer by injecting a second resin composition below the lower conductive plate while maintaining the mold at a second temperature;
- and
- obtaining the lower conductive plate, the upper conductive plate, the lower resin layer, and the upper resin layer fused together by disassembling the mold.
Dependencies are inferred from the claim text.