V-bonding using double stacked stand-off-stitch for improved rf performance

A method of forming a wire bond assembly, the method comprising:

• wire bonding a first end of a first bond wire to a first conductive bonding surface arranged on a first substrate to form a first conductive bond formation;
• wire bonding a second end of the first bond wire to a second conductive bonding surface arranged on a second substrate to form a second conductive bond formation;
• forming a first conductive structure on top of the first conductive bond formation;
• forming a second conductive structure on top of the second conductive bond formation;
• wire bonding a first end of a second bond wire to a top of the first conductive structure to form a third conductive bond formation;
• and
• wire bonding a second end of the second bond wire to a top of the second conductive structure to form a fourth conductive bond formation.

A wire bond assembly, comprising:

• a first substrate comprising a first conductive bonding surface;
• a second substrate comprising a second conductive bonding surface;
• a first conductive bump arranged on the first conductive bonding surface;
• a first conductive ball arranged on the second conductive bonding surface, wherein the first conductive ball is bonded to a first end of a first bond wire;
• a second conductive ball arranged on the second conductive bonding surface, wherein the second conductive ball is bonded to a first end of a second bond wire, and wherein the second conductive ball is laterally separated from the first conductive ball on the second conductive bonding surface;
• and
• a second conductive bump,
• wherein a second end of the first bond wire is wire bonded to a top of the first conductive bump to form a first conductive bond formation,
• wherein the second conductive bump is arranged on the first conductive bond formation, and
• wherein a second end of the second bond wire is wire bonded to a top of the second conductive bump to form a second conductive bond formation.