Method for mounting bonding material deposits

A method of mounting bonding material deposits in mounting recesses formed in a mask, the method comprising:

• a step (a):
• arranging the mask horizontally;
• a step (b):
• arranging a mounting head to be adjacent to an upper surface of the mask, the mounting head including:
• a head body including a first wall member and a second wall member arranged to face each other and horizontally extending in parallel with each other, a first connection member and a second connection member connecting opposite ends of the first wall member and the second wall member, a central chamber surrounded by the first wall member and the second wall member and the first connection member and the second connection member so that the bonding material deposits stay therein, and a cover member covering an upper side of the central chamber;
• a first main nozzle extending in a lengthwise direction of the first wall member on a lower portion of the first wall member so as to discharge compressed gas toward an inner lower portion of the central chamber;
• and a second main nozzle extending in a lengthwise direction of the second wall member on a lower portion of the second wall member so as to discharge the compressed gas toward an inner lower portion of the second wall member;
• a step (c) supplying the bonding material deposits into the central chamber of the mounting head;
• a step (d) discharging the compressed gas respectively through the first main nozzle and the second main nozzle of the mounting head;
• and
• a step (e) transporting the mounting head horizontally with respect to the mask while performing the step (d) so that the bonding material deposits in the central chamber of the mounting head are mounted in the mounting recesses of the mask.