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US 2025/0223221 A1Published application
Glass substrate
AssigneeAGC Inc.
InventorsYuha KOBAYASHI, Kaede Okamoto
Life of this patent
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Abstract
To suppress a fracture at the time of laser machining. A glass substrate has a surface on which a mark is provided, and a parameter (y) thereof defined by an expression (1) is smaller than 1.4.
Claims12
A glass substrate having a surface on which a mark is provided, wherein a parameter y defined by the following expression (1) is smaller than 1.4,
- y
- =
- 0
- .
- 0
-
- 21
- ·
- C
- -
- 0.0034
- ·
- Tg
- -
- 0.012
- ·
- ρ
- +
- 0.02
- ·
- E
- -
- 2
-
- .814
- ·
- λ
- -
- 0.433
- ·
- Ra
- +
- 4.372
- (
- 1
- )
- where
- C is an average thermal expansion coefficient (ppm/° C.) of the glass substrate at 50° C. to 200° C.,
- Tg is a glass transition temperature (° C.) of the glass substrate,
- ρ is a density (g/cm3) of the glass substrate,
- E is a Young's modulus (GPa) of the glass substrate,
- λ is a thermal conductivity (W/m.° C.) of the glass substrate, and
- Ra is an arithmetic average roughness (nm) defined in JIS B 0601:2001 of the surface of the glass substrate.
40 more elements
Dependencies are inferred from the claim text.