Wideband filter with resonators and inductors

A computer-readable medium storing computer executable code, operable on a device comprising at least one processor and at least one memory coupled to the at least one processor, wherein the at least one processor is configured to implement one or more individual bandpass filters on an integrated circuit (IC), the computer executable code comprising:

• instructions for causing a computer to position a first redistribution layer (RDL) in a wafer layer on the integrated circuit (IC);
• instructions for causing the computer to place one or more vertical conductive pillars above the wafer layer;
• instructions for causing the computer to assemble a plurality of resonator chips onto the wafer layer;
• instructions for causing the computer to cover the wafer layer with a molding material to form a molded wafer layer;
• instructions for causing the computer to form a plurality of inductors by coating a first passivation layer onto the molded wafer layer, by plating a second redistribution layer (RDL) over the first passivation layer and by coating a second passivation layer above the second RDL;
• instructions for causing the computer to form an interconnection layer above the second passivation layer;
• and
• instructions for causing the computer to dice the integrated circuit (IC) to obtain one or more individual bandpass filters.

A computer-readable medium storing computer executable code, operable on a device comprising at least one processor and at least one memory coupled to the at least one processor, wherein the at least one processor is configured to implement one or more individual bandpass filters on an integrated circuit (IC), the computer executable code comprising:

• instructions for causing a computer to form a through glass via (TGV) within a wafer layer on the integrated circuit (IC);
• instructions for causing the computer to coat a first passivation layer on top of the wafer layer and to place a first redistribution layer (RDL) above the first passivation layer, wherein the first RDL is placed over one or more vertical conductive pillars;
• instructions for causing the computer to coat a second passivation layer above the first RDL and to expose a portion of the second passivation layer for assembling one or more resonator chips;
• instructions for causing the computer to use a plating process to place one or more interconnection pads above the second passivation layer;
• instructions for causing the computer to cover the second passivation layer and the one or more resonator chips with a molding material;
• instructions for causing the computer to flip the integrated circuit (IC), to coat the wafer layer with a third passivation layer and to place a second RDL above the third passivation layer to form a plurality of inductors;
• instructions for causing the computer to coat a fourth passivation layer above the second RDL and to create an interconnection layer above the fourth passivation layer;
• and
• instructions for causing the computer to dice the integrated circuit (IC) to obtain one or more individual bandpass filters.