# US 2025/0219554 A1 · Systems and methods for cooling system and power module for inverter for electric vehicle > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0219554 A1 - Document ID: US20250219554A1 - Status: Published application - Kind: A1 - Application number: 19/086,706 - Filed: 2025-03-21 - Published: 2025-07-03 - Earliest claimed: 2022-09-28 - Assignees: BorgWarner US Technologies LLC - Applicants: BorgWarner US Technologies LLC - Inventors: Bryan Rohl; Chris Fruth - Web page: https://patentgrep.com/patent/US20250219554A1 ## CPC - H02M 7/5387: in a bridge configuration - H05K 7/20872: {Liquid coolant without phase change} - B60L 3/003: {relating to inverters} - B60L 15/007: {Physical arrangements or structures of drive train converters specially adapted for the propulsion motors of electric vehicles} - B60L 15/08: using pulses - B60L 50/40: using propulsion power supplied by capacitors - B60L 50/51: characterised by AC-motors - B60L 50/60: using power supplied by batteries (in combination with fuel cells B60L50/75) - B60L 50/64: Constructional details of batteries specially adapted for electric vehicles - B60L 53/20: characterised by converters located in the vehicle - B60L 53/22: Constructional details or arrangements of charging converters specially adapted for charging electric vehicles - B60L 53/62: in response to charging parameters, e.g. current, voltage or electrical charge - B60R 16/02: electric {constitutive elements} - G01R 15/20: using galvano-magnetic devices, e.g. Hall-effect devices {, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices} - G06F 1/08: Clock generators with changeable or programmable clock frequency - G06F 13/4004: {Coupling between buses} - H02J 7/855: {with circuits adapted for supplying loads from the battery} - H02M 1/0054: {Transistor switching losses (periodically suspending operation of switching converter in low power mode H02M1/0035)} - H02M 1/08: Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters - H02M 1/084: using a control circuit common to several phases of a multi-phase system - H02M 1/088: for the simultaneous control of series or parallel connected semiconductor devices - H02M 1/123: {Suppression of common mode voltage or current} - H02M 1/32: Means for protecting converters other than automatic disconnection - H02M 1/322: {Means for rapidly discharging a capacitor of the converter for protecting electrical components or for preventing electrical shock} - H02M 1/327: {against abnormal temperatures} - H02M 1/4258: {using a single converter stage both for correction of AC input power factor and generation of a regulated and galvanically isolated DC output voltage (H02M1/4241 takes precedence)} - H02M 1/44: Circuits or arrangements for compensating for electromagnetic interference in converters or inverters - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H02M 7/537: using semiconductor devices only, e.g. single switched pulse inverters - H02M 7/53871: {with automatic control of output voltage or current} - H02M 7/53875: {with analogue control of three-phase output} - H02M 7/5395: by pulse-width modulation - H02P 27/06: using DC to AC converters or inverters (H02P27/05 takes precedence) - H02P 27/08: with pulse width modulation - H02P 27/085: {wherein the PWM mode is adapted on the running conditions of the motor, e.g. the switching frequency} - H02P 29/024: Detecting a fault condition, e.g. short circuit, locked rotor, open circuit or loss of load - H02P 29/027: {the fault being an over-current} - H02P 29/68: based on the temperature of a drive component or a semiconductor component - H05K 1/145: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules} - H05K 1/181: associated with surface mounted components - H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] - H05K 5/0247: {Electrical details of casings, e.g. terminals, passages for cables or wiring} - H05K 7/20154: {Heat dissipaters coupled to components} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/2049: {Pressing means used to urge contact, e.g. springs} - H05K 7/20854: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence)} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H05K 7/20927: {Liquid coolant without phase change} - H10D 64/018: {Spacers formed inside holes at the prospective gate locations, e.g. holes left by removing dummy gates} - H10W 40/037: {Assembling together parts thereof} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)} - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 40/43: by flowing gases, e.g. forced air cooling - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 40/611: {Bolts or screws} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 70/611: {for connecting multiple chips together} - H10W 70/685: comprising multiple insulating layers - H10W 70/692: Ceramics or glasses - H10W 90/00: Package configurations - B60L 15/20: for control of the vehicle or its driving motor to achieve a desired performance, e.g. speed, torque, programmed variation of speed - B60L 2210/30: AC to DC converters - B60L 2210/40: DC to AC converters - B60L 2210/42: Voltage source inverters - B60L 2210/44: Current source inverters - B60L 2240/36: Temperature of vehicle components or parts - G06F 2213/40: Bus coupling - H02J 2207/20: Charging or discharging characterised by the power electronics converter - H02M 1/0009: {Devices or circuits for detecting current in a converter} - H02M 3/33523: {with galvanic isolation between input and output of both the power stage and the feedback loop} - H02P 2207/05: Synchronous machines, e.g. with permanent magnets or DC excitation - H03K 19/20: characterised by logic function, e.g. AND, OR, NOR, NOT circuits (H03K19/003 - H03K19/01 take precedence) - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/10166: Transistor - H10W 40/235: {attached to package parts} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 72/07354: {changes in dispositions} - H10W 72/347: {Dispositions of multiple die-attach connectors} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B60L: PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES (arrangements or mounting of electrical propulsion units or of plural diverse prime-movers for mutual or common propulsion in vehicles B60K1/00, B60K6/20; arrangements or mounting of electrical gearing in vehicles B60K17/12, B60K17/14; preventing wheel slip by reducing power in rail vehicles B61C15/08; dynamo-electric machines H02K; control or regulation of electric motors H02P); SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES (electric coupling devices combined with mechanical couplings of vehicles B60D1/64; electric heating for vehicles B60H1/00); ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL (control or regulation of electric motors H02P); MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES - B60R: VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H02J: ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY - H02P: CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) ## Abstract A base for an electrical component includes: a body, the body defining: a rim, pin slots, and first engagement slots; contact terminals; and electrical connectors, each of the electrical connectors being positioned within a respective pin slot and including a pin terminal positioned on a first surface of the body; wherein the base is configured to provide an electrical connection between one or more power modules and a substrate. ## Claims ### Claim 1 A base for an electrical component, the base comprising: a body defining first engagement slots; contact terminals; and electrical connectors, each of the electrical connectors being positioned within the body and including a pin terminal positioned on a first surface of the body; wherein the base is configured to provide an electrical connection between one or more power modules and a substrate. ### Claim 2 (depends on 1) The base of claim 1, wherein the first engagement slots are configured to receive prongs secured to the one or more power modules and secure the one or more power modules to the substrate. ### Claim 3 (depends on 1) The base of claim 1, wherein the body further defines first and second apertures configured to receive first and second fittings of a heatsink. ### Claim 4 (depends on 1) The base of claim 1, further comprising: fasteners configured to secure the base to the substrate, wherein the body defines apertures within a rim of the body configured to receive the fasteners. ### Claim 5 (depends on 1) The base of claim 1, wherein the body further defines second engagement slots, and wherein the first engagement slots are configured to receive first prongs and the second engagement slots are configured to receive second prongs different from the first prongs. ### Claim 6 (depends on 1) The base of claim 1, wherein the base is configured to provide the electrical connection with one or more of the contact terminals or respective pin terminals of the electrical connectors. ### Claim 7 (depends on 6) The base of claim 6, wherein one or more of the contact terminals is configured to be electrically connected to a terminal of the one or more power modules. ### Claim 8 (depends on 6) The base of claim 6, wherein the pin terminals are configured to be electrically connected to signal pins of the one or more power modules. ### Claim 9 (depends on 1) The base of claim 1, wherein each electrical connector includes a connection pin that extends from a respective pin terminal and is disposed in a pin slot corresponding to the electrical connector. ### Claim 10 (depends on 9) The base of claim 9, wherein each pin slot is configured to receive a tab of a respective connection pin disposed in the pin slot, and wherein the tab is configured to limit movement of a respective electrical connector toward the first surface. ### Claim 11 (depends on 9) The base of claim 9, wherein connection pins of the electrical connectors extend from respective pin slots through a second surface of the base. ### Claim 12 (depends on 9) The base of claim 9, wherein the body defines protrusions extending from the first surface, and wherein the protrusions define pin grooves configured to receive respective pin terminals of the electrical connectors. ### Claim 13 (depends on 9) The base of claim 9, wherein the body defines pin grooves on the first surface, and wherein each pin groove is configured to receive a pin terminal of an electrical connector and a signal pin of the one or more power modules. ### Claim 14 An electrical component comprising: a cooling system; a plurality of power modules integrated into the cooling system; and a base including: a body defining a rim and a recessed wall surrounded by the rim, contact terminals, and electrical connectors including terminal and pin components, the electrical connectors extending through the rim; wherein the base is configured to provide electrical connections between the plurality of power modules and a substrate. ### Claim 15 (depends on 14) The electrical component of claim 14, wherein each electrical connector includes a pin terminal and a connection pin disposed in a pin slot, wherein each pin terminal is positioned on a first surface of the body facing the cooling system and each connection pin extends through a second surface of the body configured to face the substrate. ### Claim 16 (depends on 14) The electrical component of claim 14, wherein each electrical connector includes a pin terminal positioned on a surface of the rim, wherein each contact terminal is positioned next to one or more electrical connectors, wherein signal pins of the plurality of power modules are electrically connected to pin terminals of the electrical connectors, and wherein terminals of the plurality of power modules are electrically connected to the contact terminals of the base. ### Claim 17 (depends on 14) The electrical component of claim 14, wherein the cooling system includes a first heatsink and a second heatsink, wherein the plurality of power modules are positioned between the first heatsink and the second heatsink. ### Claim 18 (depends on 14) The electrical component of claim 14, wherein the cooling system includes one or more active cooling heatsinks. ### Claim 19 (depends on 18) The electrical component of claim 18, wherein the body of the base further defines first and second apertures in the recessed wall, wherein the first aperture accommodates a first fluid connection to an inlet of the active cooling heatsink and the second aperture accommodates a second fluid connection to an outlet of the active cooling heatsink. ### Claim 20 A subassembly for an electrical component comprising: a first heatsink; a second heatsink; a plurality of power modules positioned between the first heatsink and the second heatsink; and a base including: a body defining first engagement slots; contact terminals; and electrical connectors including terminal and pin components, each of the electrical connectors being positioned within the body and including a pin terminal positioned on a first surface of the body; wherein one or more of the contact terminals or the electrical connectors is configured to provide electrical connections between the plurality of power modules and a substrate, and wherein the first heatsink is positioned within the body of the base.