# US 2025/0218878 A1 · Lidded electronic package containing a battery

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- Number: US 2025/0218878 A1
- Document ID: US20250218878A1
- Status: Published application
- Kind: A1
- Application number: 18/611,066
- Filed: 2024-03-20
- Published: 2025-07-03
- Earliest claimed: 2023-12-28
- Assignees: NXP USA, Inc.
- Applicants: NXP USA, Inc.
- Inventors: Ankur Shailesh Shah; Michael B. Vincent; You GE
- Web page: https://patentgrep.com/patent/US20250218878A1

## CPC

- H10W 76/13: Containers comprising a conductive base serving as an interconnection
- H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00)
- H10W 72/00: Interconnections or connectors in packages
- H10W 76/15: Containers comprising an insulating or insulated base
- H10W 76/17: characterised by their materials
- H10W 76/60: Seals
- H10W 95/00: Packaging processes not covered by the other groups of this subclass
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W 72/0198: {batch processes}
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 72/075: {of bond wires}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 76/10: Containers or parts thereof
- H10W 76/63: characterised by their shape or disposition, e.g. between cap and walls of a container
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic package with a battery and method for producing the electronic package uses a domed lid that is attached to a substrate with an electronic component, such as a die. The battery is attached to an inner surface of the domed lid and electrically connected to the electronic component via the domed lid.

## Claims

### Claim 1

An electronic package comprising:
a substrate;
an electronic component attached to the substrate;
a domed lid attached to the substrate such that the electronic component is enclosed by the domed lid; and
a battery attached to an inner surface of the domed lid and electrically connected to the electronic component via the domed lid.

### Claim 2 (depends on 1)

The electronic package of claim 1, wherein the battery includes positive and negative sides and wherein at least one of the positive and negative sides of the battery is electrically connected to an electrical trace on the inner surface of the domed lid that is electrically connected to the electronic component via the substrate.

### Claim 3 (depends on 1)

The electronic package of claim 1, wherein the electronic component is a die physically attached to the substrate and electrically attached to the substrate via bondwires and wherein positive and negative sides of the battery are electrically connected to conductive traces on the inner surface of the domed lid that are electrically connected to the die via the substrate and the bondwires.

### Claim 4 (depends on 1)

The electronic package of claim 1, further comprising epoxy that covers the bondwires.

### Claim 5 (depends on 1)

The electronic package of claim 1, wherein the electronic component is a die attached to the substrate and wherein at least one of positive and negative sides of the battery is electrically connected to an electrical trace on the inner surface of the domed lid that is electrically connected to the die via the substrate.

### Claim 6 (depends on 5)

The electronic package of claim 5, wherein one of the positive and negative sides of the battery is physically attached to the die using an electrically conductive adhesive material such that the die is sandwiched between the battery and the substrate.

### Claim 7 (depends on 6)

The electronic package of claim 6, wherein the electrically conductive adhesive material is electrically connected to at least one electrically conductive via in the die to electrically connect the battery to the substrate.

### Claim 8 (depends on 6)

The electronic package of claim 6, wherein the electrically conductive adhesive material extends to a side of the die and onto the substrate to electrically connect the battery to the substrate.

### Claim 9 (depends on 1)

The electronic package of claim 1, wherein the domed lid is a pre-molded electrically insulating structure.

### Claim 10 (depends on 1)

The electronic package of claim 1, wherein the domed lid is attached to the substrate using an electrically conductive adhesive material that provides electrical connection between the domed lid and the substrate.

### Claim 11 (depends on 10)

The electronic package of claim 10, wherein the domed lid includes an electrical trace on the inner surface of the domed lid that is electrically connected to the battery and the electrically conductive adhesive material.

### Claim 12 (depends on 1)

The electronic package of claim 1, wherein the electronic component is a die, a multi-die component, a stacked die or a surface mounted device (SMD) component.

### Claim 13

A method for producing an electronic package, the method comprising:
providing a substrate with an electronic component attached to the substrate;
mounting a battery to an inner surface of a domed lid; and
attaching the domed lid to the substrate such that the electronic component is enclosed by the domed lid along with the battery and the battery is electrically connected to the electronic component via the domed lid.

### Claim 14 (depends on 13)

The method of claim 13, wherein the battery includes positive and negative sides and wherein mounting the battery includes electrically connecting at least one of the positive and negative sides of the battery to an electrical trace on the inner surface of the domed lid so that the battery is electrically connected to the electronic component via the substrate when the domed lid is attached to the substrate.

### Claim 15 (depends on 13)

The method of claim 13, wherein the electronic component is a die physically attached to the substrate and electrically attached to the substrate via bondwires and wherein mounting the battery includes electrically connecting positive and negative sides of the battery to conductive traces on the inner surface of the domed lid so that the positive and negative sides of the battery are electrically connected to the die via the substrate and the bondwires when the domed lid is attached to the substrate.

### Claim 16 (depends on 13)

The method of claim 13, wherein the electronic component is a die attached to the substrate and wherein mounting the battery includes electrically connecting at least one of positive and negative sides of the battery to an electrical trace on the inner surface of the domed lid so that the battery is electrically connected to the die via the substrate when the domed lid is attached to the substrate.

### Claim 17 (depends on 16)

The method of claim 16, wherein attaching the domed lid to the substrate includes physically attaching one of the positive and negative sides of the battery to the die using an electrically conductive adhesive material such that the die is sandwiched between the battery and the substrate.

### Claim 18 (depends on 17)

The method of claim 17, wherein physically attaching one of the positive and negative sides of the battery to the die includes electrically connecting the electrically conductive adhesive material to at least one electrically conductive via in the die to electrically connect the battery to the substrate.

### Claim 19 (depends on 17)

The method of claim 17, wherein physically attaching one of the positive and negative sides of the battery to the die includes extending the electrically conductive adhesive material to a side of the die and onto the substrate to electrically connect the battery to the substrate.

### Claim 20

An electronic package comprising:
a substrate;
a die attached to the substrate;
a domed lid with a conductive trace attached to the substrate such that the die is enclosed by the domed lid and the conductive trace is electrically connected to the substrate; and
a battery attached to an inner surface of the domed lid and electrically connected to the conductive trace of the domed lid.