Low dielectric high tg resin composition for improvement of processability, prepreg and metal clad laminate

A low dielectric high Tg resin composition, comprising:

• (A) a resin system including 10 wt % to 40 wt % of a low dielectric resin, 5 wt % to 20 wt % of a crosslinking agent, and 10 wt % to 70 wt % of a polyindene resin, based on a total weight of the resin system, wherein the low dielectric resin is formed from a monomer composition including styrene, divinylbenzene, and ethylene;
• (B) a halogen-free flame retardant;
• (C) a coupling agent;
• and
• (D) an inorganic filler;
• wherein, with respect to 100 phr of the resin system, an amount of the halogen-free flame retardant ranges from 20 phr to 45 phr, an amount of the coupling agent ranges from 0.05 phr to 5 phr, and an amount of the inorganic filler ranges from 50 phr to 120 phr;
• wherein the low dielectric high Tg resin composition has a glass transition temperature not less than 200° C., and the low dielectric high Tg resin composition after being cured has a dielectric constant (Dk) between 3.0 and 3.2 and a dielectric loss factor (Df) less than 0.0013 at 10 GHz.