Encapsulated flexible electronics for long-term implantation

A liquid and liquid vapor-proof material, comprising:

• a first substrate having a first-side encapsulating layer supported by at least a portion of the first substrate;
• a material provided onto the first-side encapsulating layer;
• a second substrate having a second-side encapsulating layer supported by at least a portion of the second substrate;
• a barrier layer covering an exposed surface of the material provided onto the first-side encapsulation layer with the second-side encapsulating layer;
• and
• wherein said encapsulating layers are substantially defect free so that liquid or liquid vapor is prevented from passing through each of the encapsulating layers;
• thereby making the liquid or liquid vapor-proof material.

An implantable electronic device, comprising:

• a first thermally oxidized layer formed on a first substrate, wherein the first thermally oxidized layer forms a first encapsulation layer;
• one or more electronic devices supported by the first thermally oxidized layer;
• a barrier layer that covers said one or more electronic devices;
• a second thermally oxidized layer formed on a second substrate, wherein the second thermally oxidized layer forms a second encapsulation layer in contact with the barrier layer;
• wherein each of the first t encapsulation layer, the second encapsulation layer, the barrier layer, and said one or more electronic devices is flexible or bendable, so that the implantable electronic device is capable of conformal contact with a curved biological surface.