# US 2025/0210495 A1 · Microelectronic assemblies with selective metallization for glass cores > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0210495 A1 - Document ID: US20250210495A1 - Status: Published application - Kind: A1 - Application number: 18/392,119 - Filed: 2023-12-21 - Published: 2025-06-26 - Earliest claimed: 2023-12-21 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Jeremy Ecton; Brandon C. Marin; Suddhasattwa Nad; Srinivas Venkata Ramanuja Pietambaram; Gang Duan - Web page: https://patentgrep.com/patent/US20250210495A1 ## CPC - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/095: {of vias therein} - H10W 70/611: {for connecting multiple chips together} - H10W 70/635: {Through-vias} - H10W 70/685: comprising multiple insulating layers - H10W 70/69: Insulating materials thereof - H10W 70/692: Ceramics or glasses - H10W 90/00: Package configurations - H10W 70/682: {comprising holes having chips therein} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/794: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Selective metallization for fabricating conductive vias in glass cores, as well as related devices, are disclosed. In one aspect, a method for fabricating a conductive via in a glass core using selective metallization includes forming an opening in the glass core, the opening extending from a surface of the glass core (e.g., from the top surface) towards an opposite surface of the glass core (e.g., towards the bottom surface), lining sidewalls of the opening with a seed material, depositing a passivation material onto the surface of the glass core from which the opening lined with the seed material extends into the glass core, and subsequently filling the opening with a conductive fill material. The passivation material is a material that reduces or prevents deposition of the conductive fill material thereon. ## Claims ### Claim 1 A microelectronic assembly, comprising: a glass core having a first face, a second face opposite the first face, and an opening extending from the first face towards the second face; a first conductive material on a sidewall of the opening; a second conductive material in the opening, wherein the first conductive material is closer to the sidewall than the second conductive material; and a further material between a portion of the first conductive material and a portion of the second conductive material. ### Claim 2 (depends on 1) The microelectronic assembly according to claim 1, wherein a material composition of the further material is different from a material composition of the first conductive material and a material composition of the second conductive material. ### Claim 3 (depends on 1) The microelectronic assembly according to claim 1, wherein the further material includes a metal and oxygen. ### Claim 4 (depends on 1) The microelectronic assembly according to claim 1, wherein the further material includes at least one of titanium, ruthenium, or tungsten. ### Claim 5 (depends on 1) The microelectronic assembly according to claim 1, wherein the further material includes a semiconductor and one or more of oxygen or nitrogen. ### Claim 6 (depends on 1) The microelectronic assembly according to claim 1, wherein the further material is an insulator material. ### Claim 7 (depends on 1) The microelectronic assembly according to claim 1, wherein the further material extends from the first face towards the second face by a distance between about 0.1% and about 10% of a distance between the first face and the second face. ### Claim 8 (depends on 1) The microelectronic assembly according to claim 1, wherein the further material extends from the first face towards the second face by a distance between about 200 nanometers and about 200 micron. ### Claim 9 (depends on 1) The microelectronic assembly according to claim 1, wherein an average thickness of the further material is between about 5 nanometers and about 5 micron. ### Claim 10 (depends on 1) The microelectronic assembly according to claim 1, wherein: the portion of the first conductive material is a first portion of the first conductive material, the portion of the second conductive material is a first portion of the second conductive material, the further material between the first portion of the first conductive material and the first portion of the second conductive material is a first portion of the further material, and the microelectronic assembly further includes a second portion of the further material between a second portion of the first conductive material and a second portion of the second conductive material, wherein the first portion of the further material is closer to the first face than the second portion of the further material. ### Claim 11 (depends on 10) The microelectronic assembly according to claim 10, wherein the second portion of the further material is materially discontinuous from the first portion of the further material. ### Claim 12 (depends on 10) The microelectronic assembly according to claim 10, wherein the second portion of the further material and the first portion of the further material are separated by the second conductive material or the first conductive material. ### Claim 13 (depends on 1) The microelectronic assembly according to claim 1, wherein the opening extends to the second face. ### Claim 14 A microelectronic assembly, comprising: a layer of glass comprising a rectangular prism volume; and a via extending from a first side of the rectangular prism volume to a second side of the rectangular prism volume, the via including a first metal, a second metal, and an insulator material between a portion of the first metal and a portion of the second metal. ### Claim 15 (depends on 14) The microelectronic assembly according to claim 14, wherein the insulator material includes: a metal or a semiconductor, and oxygen or nitrogen. ### Claim 16 (depends on 14) The microelectronic assembly according to claim 14, wherein: the portion of the first metal is a first portion of the first metal, the portion of the second metal is a first portion of the second metal, the insulator material between the first portion of the first metal and the first portion of the second metal is a first portion of the insulator material, and the via further includes a second portion of the insulator material between a second portion of the first metal and a second portion of the second metal, wherein the first portion of the insulator material is closer to the first face than the second portion of the insulator material, and the second portion of the insulator material is closer to the second face than the first portion of the insulator material. ### Claim 17 (depends on 16) The microelectronic assembly according to claim 16, wherein the first portion of the insulator material extends from the first face towards the second face, and the second portion of the insulator material extends from the second face towards the first face. ### Claim 18 (depends on 16) The microelectronic assembly according to claim 16, wherein the first portion of the insulator material extends from the first face towards the second face by a distance less than about 10% of a distance between the first face and the second face, and the second portion of the insulator material extends from the second face towards the first face by a distance less than about 10% of the distance between the first face and the second face. ### Claim 19 A method of fabricating a microelectronic assembly, the method comprising: providing a liner of a first conductive material on sidewalls of an opening in a glass core, wherein the glass core has a first face and a second face opposite the first face, and the opening extends from the first face towards the second face; depositing a further material over the first face; and depositing a second conductive material within the opening with the liner of the first conductive material. ### Claim 20 (depends on 19) The method according to claim 19, wherein a portion of the further material extends, from the first face into the opening, and wherein the portion of the further material is between a portion of the first conductive material within the opening and a portion of the second conductive material within the opening.